KUCHING: X-FAB Silicon Foundries, one of the leading analog/mixed-signal foundries has now expanded its 0.35 micrometre technology offerings with the first foundry technology optimised for Bluray and high-speed optical data communication applications.Dubbed XO035, the new 0.35 micrometre process includes X-FAB’s unique blue PIN module.
In a statement issued from its headquarters in Erfurt, Germany, it said this integration of the PIN diode into the widely used 0.35 micrometre CMOS environment enables the design of high-performance photo detectors.
Both the sensitivity, especially in the blue wavelength range and the speed for the entire detectable light spectrum are higher than for X-FAB’s optical sensor at 0.6 micrometres, allowing customers to develop their next generation of products.
Available now, the XO035 is ideal for all applications for which high sensitivity and high bandwidth are crucial, such as photo detector chips (PDICs) for Blu-ray and other optical data storage applications, optical data communication devices and high dynamic range cameras.
Fellow and manager CMOS/BiCMOS development at X-FAB, Dr Konrad Bach said, “X-FAB is pushing the optoelectronics envelope with its new PIN diode. It offers the highest sensitivity for blue light in the market, about 0.31 Amperes per Watt which is close to the physical limit.
“This high sensitivity, combined with high bandwidth and low noise, enables the design of a leading-edge PDIC with 12 times Blu-ray speed,” he added.
The PIN diode’s sensitivity for red and IR wavelengths is higher than 0.4 A/W, resulting in good performance for DVDs and CDs, and making it suitable for combined optical data storage drives.
The modular approach also offers bipolar transistors required for low noise applications, and fast MOS transistors required to support high-speed PIN diodes with signal conditioning.
X-FAB is the only foundry that provides integrated PIN diodes as part of its standard
CMOS offerings, in combination with optical window etching and an ARC (Anti- eflective Coating) layer on top.
X-FAB also offers a suite of RF active and passive components as part of its general analog/mixedsignal standard offering.
These features allow customers to design integrated optoelectronic systems on a single chip instead of the two-chip solutions required previously.
A single-chip solution increases total performance for sensitivity and bandwidth as well as reduces total system costs.
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixedsignal ICs).
X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,500 people worldwide.